Showing results: 781 - 795 of 1333 items found.
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CST-300/200 -
Jinan Testing Equipment IE Corporation
The Compression and Flexure Testing Machine is mainly designed for compression and bending tests of cement & mortar specimens. The Compression and Flexure Tester for Current can finish compression and flexure tests automatically by one-key action . Computer & software are also adopted to make the operation even easier. With new design and advanced technology, the series of Compression and Flexure Testing Machine have more advantages in appearances operation & applications. The Compression and Flexure Tester for Cement is an ideal tester for quality control at industrial & mineral enterprises, teaching in high schools, and technology researching al scientific industries.
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Thermal Engineering Associates, Inc.
TEA offers a series of thermal test boards for package characterization and design comparison that conform to to the JEDEC JESD51 standards. The board family, referred to as the TTB-1000 series, consists of two different standard sizes designed to cover a wide range of package sizes. These boards, also referred to as test coupons, provide a well defined mounting environment, will withstand temperatures to 125 oC, and have lead lands terminated in eyelets to allow for hand-wired connection to the board edge contacts. The board mates with a dual 18-pin, 3.962 mm (0.156") pitch edge-card connector.
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Sinowon Innovation Metrology Manufacture Ltd.
◆ Metal shell, nice appearance design.◆ Available to save 2000 groups test results.◆ Support hardness conversion among HRC, HRA, HRB, HV, HB, etc, can convert 2 different scales simultaneously.◆ 4” LCD to display hardness result, conversion results, Max, Min,Mean value;◆ Support blue tooth printer, with RS232 to connect computer for software running;◆ Can test all kinds of metal which more than 5kg;◆ Indicating error ±5HLD, conform standard ASTM A956;◆ Support 7 types of impact devices.
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ACMAS Technologies Pvt. Ltd.
WEIBER designs and manufactures standard as well as customized water spray test chamber for evaluating various automotive, electrical and electronics items under water, rain or shower conditions. The chamber interrogates the performance of parts when subjected to water droplets.The system is based on the IP X5, X6 specification requirements, and can also accomplish individual automaker’s tests, as well as electrical-enclosure tests.Our system uses multiple control solenoids to vary the water's spray volume/pressure. A holding tank prepares the water to the desired temperature, if required. A pump ensures the water is delivered in the proper pressure range.
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ProcVision -
Gidel
Gidel’s Vision Pro Development Kit is an optimal solution for developing,validating, demonstrating and evaluating Image Processing (IP) andpipeline designs on FPGA.The suite is designed to provide a complete and convenient envelop enablingthe developer to focus strictly on the proprietary image processingdesign. The entire Vision Pro flow is within a single FPGA, independentof the final target application(s). The Vision Pro flow is composedof a pipeline that streams simulated data to the user image processingdesign under test (DUT) and then captures the design’s output streamfor displaying, storing, analysis and/or co-processing on host software.The entire process is performed on a single FPGA without the need foradditional peripheral connectivity or tools.Vision Pro suite is plug-and-play enabling the developer to begin at oncethe IP design development and validation. A simple design example providesthe developer immediate hands-on familiarization with the systemflow and supporting tools. The final design can be ported to any IntelFPGA device or other vendors’ devices (FPGA or ASIC) by replacing basiclibraries. To significantly reduce compilation time, initial design developmentmay be on a small FPGA device and later compiled for the targetdevice(s). The target implementation may use any FPGA board. For a fullImaging/Vision system solution, Gidel offers a number of off-the-shelfgrabbers and FPGA accelerators that are designed to utilize these imageprocessing blocks and Gidel Imaging Library (GIL).
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GX3700e -
Marvin Test Solutions, Inc.
The GX3700e is a user configurable, FPGA–based, 3U PXI Express card offering 160 digital I/O signals which can be configured for single-ended or differential interfaces. The card employs the Altera Stratix III FPGA, which can support SerDes data rates up to 1.2 Gb/s, digital I/O clock rates of 700 MHz, and features over 45,000 logic elements and 1.836 Kb of memory. The GX3700e is supplied with an integral expansion board providing access to the FPGA’s 160 I/Os. Alternatively, users can design their own custom expansion cards for specific applications - eliminating the need for additional external boards which are cumbersome and physically difficult to integrate into a test system. The design of the FPGA is done by using Altera’s free Quartus II Web Edition tool set. Once the user has compiled the FPGA design, the configuration file can be loaded directly into the FPGA or via an on-board EEPROM.
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ATSS Series -
Thermotron Industries
Thermotron's Automated Thermal Stress Systems (ATSS) facilitate extremely rapid product temperature change rates in a space-saving, self-contained design that accelerate a Thermal Stress test. Thermotron's ATSS chambers meet the latest MIL-STD 883E and MIL-STD 202F thermal shock specifications as well as JEDEC and IPC test methods. ATSS chambers are capable of the following: Rapid thermal shocking, Accelerated product stressing, Controlled thermal cycling in a self-contained, compact design. With separate hot and cold zones, the Automated Thermal Stress System was designed with a patented retractable product transfer carrier that makes full use of the available working volume in both temperature zones for increased product loading and throughput. The product transfer carrier reduces the overall height requirements of the chamber and is made as light as possible to minimize thermal loading restraints. Thermotron ATSS chambers can be used as part of most commercial reliability and quality control programs, helping to determine:
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Shanghai Linpin Instrument
Single-wing Drop Test Machine Simulate the drop conditions of packaged products when different faces, edges and corners fall to the ground from different heights, thus to understand the damage of the product and evaluate the drop height and impact resistance that the packaging materials can endure while falling down, so as to improve and optimize package design according to actual conditions of the product and national standard range.
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Tektronix, Inc.
8 out of 10 engineers around the world trust Tektronix to help them debug and test tomorrow's designs faster. With the broadest portfolio of digital oscilloscopes available, the richest set of product features, the most extensive analysis capability and our award-winning service and support, Tektronix has the right oscilloscope to meet your needs. Learn more about the different types of oscilloscopes available.
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TE Connectivity Ltd.
TE Connectivity (TE) designs and manufactures force sensors for applications that require high performance or unique packaging, including electro-mechanical flight control, test and measurement and ultra-low cost OEM load cells for medium to high volumes. Based on our proprietary piezoresistive silicon strain gage (Microfused) technology, our sensors combine durability and long-term stability in extremely low cost packages.
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Ironwood Electronics
Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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AcQ Inducom
AcQ can perform custom developments compliant with ED12/DO-178B and ED80/DO-254 in various design assurance levels (DALs) for safety critical applications, using the ED14/DO160 for the environmental requirements. AcQ also offers standard products for various open standards like VMEbus, CPCI, PCI and other bus standards for test applications and other applications like GPS, display, actuators, data logging and -storage.
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TMD Technologies Ltd
Fully integrated microwave tubeHigh voltage switched mode power supplyBuilt in test electronics (BITE)Designed for the harshest environments – strong, sturdy, robust, MIL SpecHigh reliability – all products fully ESS tested before shipmentHigh level of customer support worldwideHigh level of product innovation – TMD won a Queen’s Award for innovation in 2005 for a low noise radar power supply design
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TX2002 -
BI Communications
Lowest Cost Full Specification Professional Graphical TDR Rugged Palm Top Design 350g (12oz) 5 Measurement Ranges up to 3500m (11,500ft) 50, 75 & 100 ohm Selectable Cable Impedance Built in Tone Generator for Pair Tracing & Identification Suitable for testing all Communications Cables Water & Dust Proof to IP54 Complete with tool-belt holster & test leads
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3 Series MDO -
Tektronix, Inc.
With the largest display in class, improved low-level signal measurement accuracy and industry-leading probe performance, the 3 Series MDO sets a new standard for bench oscilloscopes. Whether you’re testing your baseband design for IoT or just for simple EMI sniffing, the 3 Series has a unique true hardware spectrum analyzer built right in with superior RF test performance and guaranteed RF specifications.
